Today Sy&Se, the Swiss startup that has developed a pioneering new tech for bonding different types of glass to metal, has announced successfully closing a seed round from a group of private investors, including Business Angel Switzerland. Around €458.6K was raised, with a pre-money valuation slightly above €2.8 million. Sy&Se will use the fresh funds to accelerate its commercial deployment.
Sy&Se, founded in 2017, is a deeptech startup pioneering glass and metal bonding. Discovered in 2016, its innovative Impulse Current Bonding (ICB) technology was made as part of a CTI project between the HE-Arc and a group of Swiss fine watchmaking. Located in Switzerland’s Watch Valley, the new glass/metal bonding technology will now target markets including 5G mobile phones, watch making and medical devices.
Shortly after this capital increase, the legal structure of Sy&Se was changed to a Swiss Société Anonyme (public limited-liability company). Sy&Se’s Board of Directors will soon be bringing on new members from the investors of this round, to offer their expertise and support the management team during the next phases of development.